ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
| Issue | Title | File | |
| Vol 52, No 5 (2023) | The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma |
 (Rus) |
|
| Efremov A.M., Smirnov S.A., Betelin V.B. | |||
| Vol 52, No 4 (2023) | Concentration of Fluorine Atoms and Kinetics of Reactive-Ion Etching of Silicon in CF4 + O2, CHF3 + O2, and C4F8 + O2 Mixtures |
(Rus) |
|
| Efremov A.M., Bobylev A.V., Kwon K. | |||
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